Intel held a conference call on the 18th to introduce its packaging technology evolution and sales strategy. Mark Gardner, Senior Manager of Advanced Packaging at Intel, emphasized that Intel's chip manufacturing factories and assembly/testing/packaging sites are distributed worldwide and can also provide customers with some IDM processes. In other words, customers can entrust Intel with packaging or testing, but use other vendors' wafer foundry services. In addition, Pooya Tadayon, Intel's Assembly and Test Manager, also shared the future direction of Intel's advanced packaging technology, such as the use of stronger glass substrates and continued development of CPO.